High accuracy, super thin blade developed by EHWA's cutting
Minimized chipping and superior consistency in quality through stringent particle
Size distribution control
Improve productivity by high feed speed Providing an optimized solution to the customers
Wafer Top Side :
Wet Cutting with Coolant , In general, fine diamond grit leads to small top side chipping.
Wafer Back Side :
Dry Cutting without Coolant In general, coarse diamond grit minimizes back size chipping due to its cutting ability and less load imposed on each grit.